Dr David Hutt

BSc, ARCS, PhD

  • Reader in Electronics Packaging Materials

Research groups and centres

Background

  • Degree (1988) and PhD (1992) in Chemistry from Imperial College, University of London.
  • Research Associate at University of Warwick, University of Nottingham and 天堂视频.
  • Took up position of lecturer in November 1999.

Research Interests and Activities

Electronics manufacturing including:

  • Novel substrate manufacture
  • Flip-chip assembly
  • Fluxless soldering
  • Metallisation of substrates
  • Polymer encapsulation

Surface chemistry, especially Self-assembled Monolayers (SAMs) with applications in:

  • Oxidation protection and preservation of metallic surfaces
  • Ink jet printing
  • Surface activation

External Activities

  • Member of the editorial advisory board of Circuit World journal
  • Senior Member of the Institution of Electrical and Electronic Engineers (IEEE)
  • Member of the Technical Committee of the IEEE, Electronics Packaging and Technology Conference (EPTC)
  • Referee for IEEE Transactions on Electronics Packaging Manufacturing, Electrochimica Acta, Journal of Applied Physics